Custom 4-umaleko Black Soldermask PCB kunye BGA
Inkcazo yeMveliso:
| Izinto ezisisiseko: | FR4 TG170+PI |
| Ukutyeba kwePCB: | Okungqongqo: 1.8+/-10%mm, bhetyebhetye: 0.2+/-0.03mm |
| Ubalo lomaleko: | 4L |
| Ukutyeba kobhedu: | 35um/25um/25um/35um |
| Unyango loMphezulu: | ENIG 2U” |
| Imaski yeSolder: | Buluhlaza obukhazimlayo |
| Isikrini sesilika: | Mhlophe |
| Inkqubo eyodwa: | Eqinile+eguqukayo |
Isicelo
Okwangoku, itekhnoloji ye-BGA isetyenziswa kakhulu kwicandelo lekhompyuter (ikhompyuter ephathwayo, ikhompyuter enkulu, ikhompyuter yomkhosi, ikhompyuter yonxibelelwano), indawo yonxibelelwano (iipeyija, iifowuni eziphathwayo, iimodem), indawo yeemoto (abalawuli abahlukeneyo beenjini zemoto, iimveliso zokuzonwabisa zemoto) .Isetyenziswa kwiintlobo ngeentlobo zezixhobo ze-passive, ezona zixhaphakileyo zii-arrays, iinethiwekhi kunye nezihlanganisi.Izicelo zayo ezithile ziquka i-walkie-talkie, umdlali, ikhamera yedijithali kunye nePDA, njl.
Ii-FAQs
Ii-BGAs (Ii-Arrays zeGridi yeBhola) ngamacandelo e-SMD anonxibelelwano emazantsi ecandelo.Iphini nganye inikwe ibhola yesolder.Zonke iidibansi zihanjiswa kwigridi yomphezulu ofanayo okanye i-matrix kwicandelo.
Iibhodi ze-BGA zinonxibelelwano olungaphezulu kune-PCB eqhelekileyo, ivumela ukuxinana okuphezulu, iiPCB ezincinci ezinobungakanani.Ekubeni izikhonkwane zingaphantsi kwebhodi, izikhokelo nazo zifutshane, zinika i-conductivity engcono kunye nokusebenza ngokukhawuleza kwesixhobo.
Amacandelo e-BGA anepropathi apho aya kuzilungelelanisa ngokwawo njengoko i-solder iqina kwaye iqina enceda ngokubekwa okungafezekanga..Icandelo lifudunyezwe ukudibanisa izikhokelo kwi-PCB.Intaba ingasetyenziselwa ukugcina indawo yecandelo ukuba i-soldering yenziwa ngesandla.
Iiphakheji ze-BGA zibonelelaUbuninzi be-pin, ukuchasana kwe-thermal, kunye ne-inductance ephantsikunezinye iindidi zeepakethe.Oku kuthetha izikhonkwane zoqhagamshelo ezingaphezulu kunye nokusebenza okwandisiweyo ngezantya eziphezulu xa kuthelekiswa neepakethe ezimbini zomgca okanye ezisicaba.I-BGA ayikho ngaphandle kokungalungi kwayo, nangona kunjalo.
I-BGA ICskunzima ukuhlola ngenxa yezikhonkwane ezifihlwe phantsi kwepakethe okanye umzimba we-IC.Ngoko ukuhlolwa okubonakalayo akunakwenzeka kwaye i-de-soldering inzima.I-BGA IC solder edibeneyo kunye ne-PCB pad ixhomekeke kuxinzelelo lwe-flexural kunye nokudinwa okubangelwa yipateni yokufudumeza kwinkqubo yokubuyisela kwakhona.
Ikamva le-BGA Package ye-PCB
Ngenxa yezizathu zokusebenza kweendleko kunye nokuqina, iipakethe ze-BGA ziya kuthandwa ngakumbi nangakumbi kwiimarike zemveliso zombane neze-elektroniki kwixesha elizayo.Ngapha koko, kukho iintlobo ezininzi ezahlukeneyo zephakheji ye-BGA zaphuhliswa ukuhlangabezana neemfuno ezahlukeneyo kwishishini le-PCB, kwaye kukho iinzuzo ezininzi ezintle ngokusebenzisa le teknoloji, ngoko sinokulindela ikamva eliqaqambileyo ngokusebenzisa iphakheji ye-BGA, ukuba unayo imfuneko, nceda uzive ukhululekile ukuqhagamshelana nathi.
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