Custom 4-umaleko Black Soldermask PCB kunye BGA
Inkcazo yeMveliso:
Izinto ezisisiseko: | FR4 TG170+PI |
Ukutyeba kwePCB: | Okungqongqo: 1.8+/-10%mm, bhetyebhetye: 0.2+/-0.03mm |
Ubalo lomaleko: | 4L |
Ukutyeba kobhedu: | 35um/25um/25um/35um |
Unyango olungaphezulu: | ENIG 2U” |
Imaski yeSolder: | Buluhlaza obukhazimlayo |
Isikrini sesilika: | Mhlophe |
Inkqubo eyodwa: | Eqinile+eguqukayo |
Isicelo
Okwangoku, itekhnoloji ye-BGA isetyenziswa kakhulu kwicandelo lekhompyuter (ikhompyuter ephathwayo, isupercomputer, ikhompyuter yomkhosi, ikhompyuter yonxibelelwano), indawo yonxibelelwano (iipheyija, iifowuni eziphathwayo, iimodem), indawo yeemoto (abalawuli abahlukeneyo beenjini zeemoto, iimveliso zokuzonwabisa zemoto) . Isetyenziswa kwiintlobo ngeentlobo zezixhobo ze-passive, ezona zixhaphakileyo zii-arrays, iinethiwekhi kunye nezihlanganisi. Izicelo zayo ezithile ziquka i-walkie-talkie, umdlali, ikhamera yedijithali kunye nePDA, njl.
Ii-FAQs
Ii-BGAs (Ii-Arrays zeGridi yeBhola) ngamacandelo e-SMD anonxibelelwano emazantsi ecandelo. Iphini nganye inikwe ibhola yesolder. Zonke iidibansi zihanjiswa kwigridi yomphezulu ofanayo okanye i-matrix kwicandelo.
Iibhodi ze-BGA zinonxibelelwano olungaphezulu kune-PCB eqhelekileyo, ivumela ukuxinana okuphezulu, iiPCB ezincinci ezinobungakanani. Ekubeni izikhonkwane zingaphantsi kwebhodi, izikhokelo nazo zifutshane, zinika i-conductivity engcono kunye nokusebenza ngokukhawuleza kwesixhobo.
Amacandelo e-BGA anepropathi apho aya kuzilungelelanisa ngokwawo njengoko i-solder iqina kwaye iqina enceda ngokubekwa okungafezekanga.. Icandelo lifudunyezwe ukudibanisa izikhokelo kwi-PCB. Intaba ingasetyenziselwa ukugcina indawo yecandelo ukuba i-soldering yenziwa ngesandla.
Iiphakheji ze-BGA zibonelelaUbuninzi be-pin, ukuchasana kwe-thermal, kunye ne-inductance ephantsikunezinye iindidi zeepakethe. Oku kuthetha izikhonkwane zoqhagamshelo ezingaphezulu kunye nokusebenza okwandisiweyo ngezantya eziphezulu xa kuthelekiswa neepakethe ezimbini zomgca okanye ezisicaba. I-BGA ayikho ngaphandle kokungalungi kwayo, nangona kunjalo.
I-BGA ICskunzima ukuhlola ngenxa yezikhonkwane ezifihlwe phantsi kwepakethe okanye umzimba we-IC. Ngoko ukuhlolwa okubonakalayo akunakwenzeka kwaye i-de-soldering inzima. I-solder ye-BGA IC edibeneyo kunye ne-PCB pad ixhomekeke kuxinzelelo lwe-flexural kunye nokudinwa okubangelwa yipateni yokufudumeza kwinkqubo ye-reflow soldering.
Ikamva le-BGA Package ye-PCB
Ngenxa yezizathu zokusebenza kweendleko kunye nokuqina, iipakethe ze-BGA ziya kuthandwa ngakumbi nangakumbi kwiimarike zemveliso zombane neze-elektroniki kwixesha elizayo. Ngapha koko, kukho iintlobo ezininzi ezahlukeneyo zephakheji ye-BGA zaphuhliswa ukuhlangabezana neemfuno ezahlukeneyo kwishishini le-PCB, kwaye kukho iinzuzo ezininzi ezintle ngokusebenzisa le teknoloji, ngoko sinokulindela ikamva eliqaqambileyo ngokusebenzisa iphakheji ye-BGA, ukuba unayo imfuneko, nceda uzive ukhululekile ukuqhagamshelana nathi.