Iibhodi zesekethe eprintiweyo RED solder imaski imingxuma castela

Iprototype eprintiweyo iibhodi zesekethe RED solder imaski castellated imingxuma Umfanekiso Featured

Inkcazelo emfutshane:

Izinto ezisisiseko: FR4 TG140

PCB Ukutyeba: 1.0+/-10% mm

Ubalo lomaleko: 4L

Ukutyeba kobhedu: 1/1/1/1 oz

Unyango olungaphezulu: ENIG 2U”

Imaski yeSolder: Bubomvu obukhazimlayo

Silkscreen: Mhlophe

Inkqubo ekhethekileyo : Pth isiqingatha semingxuma emaphethelweni

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Inkcazo yeMveliso:

Izinto ezisisiseko:	FR4 TG140
Ukutyeba kwePCB:	1.0+/-10% mm
Ubalo lomaleko:	4L
Ukutyeba kobhedu:	1/1/1/1 oz
Unyango lomphezulu:	ENIG 2U”
Imaski yeSolder:	Ubomvu obukhazimlayo
Isikrini sesilika:	Mhlophe
Inkqubo ekhethekileyo :	Pth isiqingatha semingxuma emiphethweni

Isicelo

Iinkqubo zemingxunya enesiqingatha ezicandiweyo zezi:
1. Yenza umngxuma wesiqingatha secala kunye nesixhobo sokusika esine-V kabini.

2. I-drill yesibini yongeza imingxuma yesikhokelo kwicala lomngxuma, isusa ulusu lobhedu kwangaphambili, inciphisa i-burrs, kwaye isebenzisa ii-groove cutters endaweni ye-drills ukuze kulungiswe isantya kunye nokulahla isantya.

3. Gxininisa ubhedu kwi-electroplate i-substrate, ukwenzela ukuba umaleko wobhedu ufakwe kwi-electroplated eludongeni lomngxuma womngxuma ojikelezayo kumda webhodi.

4. Ukuveliswa kwesekethe yangaphandle yomaleko emva kokulanyiswa, ukuvezwa, kunye nophuhliso lwe-substrate ngokulandelelana, i-substrate ixhomekeke kwi-plating yobhedu yesibini kunye ne-tin yokubeka, ukwenzela ukuba umaleko wobhedu kudonga lomngxuma womngxuma ojikelezayo ibhodi iyaqina kwaye umaleko wobhedu ugutyungelwe ngumaleko we-tin wokumelana nokubola;

5. Ukwenza umngxuma wesiqingatha unqumle umngxuma ojikelezayo kumda webhodi kwisiqingatha ukwenza umngxuma;

6. Kwisinyathelo sokususa ifilimu, ifilimu ye-anti-electroplating ecinezelekileyo ngexesha lenkqubo yokucofa ifilimu iyasuswa;

7. Ukubethelwa kwe-substrate kufakwe, kwaye ubhedu oluvezwayo kuluhlu lwangaphandle lwe-substrate lususwe ngokucofa;

8. I-tin ehlutha i-substrate ihluthwe i-tin, ukwenzela ukuba i-tin eludongeni lwe-half-hole ingasuswa, kwaye ubhedu oluseludongeni lwe-half-hole lubonakaliswe.

9. Emva kokwenza, sebenzisa iteyiphu ebomvu ukuncamathelisa iibhodi zeyunithi kunye, kwaye ususe iibhula ngomgca we-alkaline etching.

10. Emva kobhedu lwesibini lobhedu kunye nokufakwa kwe-tin kwi-substrate, umngxuma ojikelezayo osekupheleni kwebhodi unqunyulwe kwisiqingatha ukuze wenze umngxuma wesiqingatha, kuba ubhedu bodonga lomngxuma lugutyungelwe ngumaleko we-tin. umaleko wobhedu wodonga lomngxuma ulungelelene ngokupheleleyo kunye nomaleko wobhedu womaleko wangaphandle we-substrate Connection, ebandakanya amandla okudibanisa olomeleleyo, unokuthintela ngokufanelekileyo umaleko wobhedu udonga lomngxuma ekutsalweni okanye ukuphoswa kobhedu xa usikwa;

11. Emva kokuba ukwakhiwa komngxuma wesiqingatha kugqityiwe, ifilimu iyasuswa kwaye igxininiswe, ukwenzela ukuba ubuso bobhedu bungabi yi-oxidized, ngokufanelekileyo ukuphepha ukwenzeka kobhedu olushiyekileyo okanye isiphaluka esifutshane, kunye nokuphucula izinga lesivuno sesiqingatha se-metallized. -umngxuma PCB ibhodi yesekethe.

Ii-FAQs

1.Yintoni ecakwe isiqingatha semingxuma?

I-half-hole efakwe kwi-half-hole okanye i-castelated-hole, i-edge enesitampu ngokusikwa kwisiqingatha kulwandlalo. I-Plated half-hole yinqanaba eliphezulu leengqungquthela ezifakwe kwiibhodi zeesekethe eziprintiweyo, ezidla ngokusetyenziselwa ukudibanisa ibhodi ukuya kwibhodi.

2.Yintoni i-PTH kunye ne-VIA?

I-Via isetyenziswa njengonxibelelwano phakathi kweemaleko zobhedu kwi-PCB ngelixa i-PTH isenziwa ngokubanzi ibe nkulu kune-vias kwaye isetyenziswa njengomngxuma ocandiweyo wokwamkelwa kwecandelo elikhokelayo - njenge-non-SMT resistors, capacitors, kunye nephakheji ye-DIP IC. I-PTH isenokusetyenziswa njengemingxuma yoqhagamshelo ngoomatshini ngelixa i-vias ayinakho.

3.Uthini umahluko phakathi kwemingxuma eplathiweyo nengafakwanga?

I-plating kwimingxunya ilubhedu, i-conductor, ngoko ivumela ukuhanjiswa kombane ukuhamba ngebhodi. I-non-plated ngokusebenzisa imingxuma ayinayo i-conductivity, ngoko ke ukuba uyayisebenzisa, unokuba neengoma zobhedu eziluncedo kwelinye icala lebhodi.

4.Ziziphi iintlobo ezahlukeneyo zemingxuma kwi-PCB?

Kukho iintlobo ezi-3 zemingxuma kwi-PCB, iPlated through Hole (PTH), i-Non-Plated through Hole (NPTH) kunye ne-Via Holes, ezi akufanele zidideke kunye ne-Slots okanye i-Cut-outs.

5.Yintoni ukunyamezela umngxuma PCB eqhelekileyo?

Ukusuka kumgangatho we-IPC, yi +/-0.08mm ye-pth, kunye +/-0.05mm ye-npth.

Ngaphambili: I-Pcb prototype pcb eyenziwe nge-blue solder imaski egcwele isiqingatha semingxuma

Okulandelayo: Pcb ibhodi prototype imingxunya isiqingatha ENIG umphezulu TG150

Bhala umyalezo wakho apha kwaye uwuthumele kuthi