Ulawulo lwemizi-mveliso PCB FR4 yokwaleka igolide 26 umaleko countersink
Inkcazo yeMveliso:
Izinto ezisisiseko: | FR4 TG170 |
Ukutyeba kwePCB: | 6.0+/-10%mm |
Ubalo lomaleko: | 26L |
Ukutyeba kobhedu: | 2 oz kuzo zonke iileya |
Unyango lomphezulu: | Ukufaka igolide 60U” |
Imaski yeSolder: | Buluhlaza obukhazimlayo |
Isikrini sesilika: | Mhlophe |
Inkqubo ekhethekileyo : | I-countersink, i-plating yegolide, ibhodi enzima |
Isicelo
I-PCB yolawulo lwemizi-mveliso yibhodi yesekethe eprintiweyo esetyenziswa kwiinkqubo zolawulo lwamashishini ukujonga nokulawula iiparamitha ezahlukeneyo ezifana nobushushu, ukufuma, uxinzelelo, isantya, kunye nezinye izinto eziguquguqukayo zenkqubo.Ezi PCBs ziqhelekile kwaye ziyilelwe ukumelana nemekobume yemizi-mveliso erhabaxa njengaleyo ifumaneka kwizityalo zokuvelisa, kwizityalo zemichiza, kunye noomatshini bemizi-mveliso.IiPCBs zolawulo lwemizi-mveliso ngokuqhelekileyo zibandakanya amacandelo afana ne-microprocessors, i-programmable logic controllers (PLCs), izinzwa, kunye ne-actuators ezinceda ukulawula kunye nokwandisa iinkqubo ezahlukeneyo.Basenokubandakanya ujongano lonxibelelwano olufana ne-Ethernet, i-CAN, okanye i-RS-232 yokutshintshiselana kwedatha kunye nezinye izixhobo.Ukuqinisekisa ukuthembeka okuphezulu kunye nokusebenza okuqhubekayo, iiPCB zolawulo lwamashishini zivavanywa ngokuqatha kunye namanyathelo okulawula umgangatho ngexesha loyilo kunye nenkqubo yokuvelisa.Kufuneka kwakhona bathobele imigangatho yoshishino efana ne-UL, CE, kunye ne-RoHS, phakathi kwabanye.
Iileya eziphezulu ze-PCB yibhodi yesekethe eprintiweyo enamaleko amaninzi okulandelela ubhedu kunye namalungu ombane afakwe phakathi kwawo.Ngokuqhelekileyo banamaleko angaphezu kwe-6 kwaye banokunyuka baye kwi-50 okanye ngaphezulu, kuxhomekeke kubunzima boyilo lwesekethe.Iimaleko eziphakamileyo zePCB ziluncedo xa kuyilwa izixhobo ezixineneyo ezifuna inani elikhulu lamacandelo.Banceda ukulungelelanisa ibhodi yesekethe ngokuhambisa iingoma ezinzima kunye nokudibanisa ngokusebenzisa iileya ezininzi.Oku kuphumela kuyilo oludityanisiweyo nolusebenzayo olugcina indawo ebhodini.Ezi bhodi ziqhele ukusetyenziswa kwizicelo eziphezulu ze-elektroniki, ezifana ne-aerospace, i-defence, kunye ne-telecommunications industry.Bafuna iindlela eziphucukileyo zokuvelisa, ezinje ngokugrumba i-laser kunye nokulawulwa kwe-impedance routing, ukuqinisekisa ukuchaneka okuphezulu kunye nokuthembeka.Ngenxa yokuntsonkotha kwazo, ukuyila kunye nokuvelisa ii-PCB zeeleya eziphezulu zinokubiza kwaye zidle ixesha kune-PCBs eziqhelekileyo.Ukongeza, okukhona i-PCB inamaleko, kokukhona iphezulu amathuba eempazamo ngexesha loyilo kunye nokuveliswa.Ngenxa yoko, iileya eziphezulu zePCB zifuna uvavanyo olubanzi kunye nemilinganiselo yokulawula umgangatho ukuqinisekisa ukusebenza nokuthembeka kwazo.
I-Countersink i-PCB ibhekisa kwinkqubo yokomba umngxuma ebhodini kwaye emva koko isebenzise i-bit yedayamitha enkulu ukwenza ikhefu elijikeleze umngxuma.Oku kwenziwa rhoqo xa intloko yesikrufu okanye ibholithi ifuna ukugungxulwa nomphezulu wePCB.I-Countersink iqhele ukwenziwa ngexesha lenqanaba lokomba lokwenziwa kwe-PCB, emva kokuba iileya zobhedu zifakiwe naphambi kokuba ibhodi idlule kwimaski ye-solder kunye nenkqubo yokuprinta isikrini sesilika.Ubungakanani kunye nokumila komngxuma wokuchasa okuzikileyo kuya kuxhomekeka kwi-screw okanye ibholithi esetyenziswayo kunye nobukhulu kunye nezinto zePCB.Kubalulekile ukuqinisekisa ukuba i-countersink ubunzulu kunye nedayamitha ifanelekile ukunqanda ukonakalisa amacandelo okanye umkhondo kwi-PCB.I-Countersink i-PCB inokuba bubuchule obuluncedo xa kuyilwa iimveliso ezifuna indawo ecocekileyo nethe tyaba.Ivumela izikrufu kunye neebholiti ukuba zihlale zigungxulwe kunye nebhodi, zenza inkangeleko ethandeka ngakumbi kwaye ithintele ukukruneka okanye umonakalo kwizibophelelo eziphuma ngaphandle.
Ii-FAQs
Ukufakwa kwegolide luhlobo lokugqitywa komphezulu wePCB, okwaziwa ngokuba yi-nickel gold electroplating.Kwinkqubo yokwenziwa kwePCB, ukufakwa kwegolide kukubeka umaleko wegolide obekwe phezu kwedyasi yesithintelo senikeli nge-electroplating.Ukucwenga kwegolide kunokohlulwa kube ''ukuyityabeka kwegolide eqinileyo'' kunye ne''eplating yegolide ethambileyo''.
Ngokuqhelekileyo isetyenziswe ngokudibanisa ne-nickel plating, umgca obhityileyo wegolide ukhusela icandelo kwi-corrosion, ukushisa, ukugqoka kunye nokuqinisekisa ukuxhamla kombane okuthembekileyo.
Ukufakwa kwegolide enzima yi-electrodeposit yegolide edityaniswe nenye into ukuguqula ubume beenkozo zegolide.Iplating yegolide ethambileyo yeyona electrodeposit yegolide esulungekileyo;ngokwesiseko yigolide esulungekileyo ngaphandle kokongeza naziphi na izinto ezidibanisayo
Umngxuma we-countersink ngumngxuma omilise okwekhowuni ochongiwe okanye ugrunjwe kwilaminate yePCB.Lo mngxunya ocoliweyo uvumela isikrufu sentloko yesokethi yentloko ukuba ifakwe kumngxunya owombiweyo.Ii-countersinks zenzelwe ukuvumela ibholithi okanye isikrufu ukuba sihlale sivaleleke ngaphakathi ngomphezulu webhodi ocwangcisiweyo.
82 degrees, 90 degrees kunye ne-100 degrees