Industrial PCB electronics PCB eliphezulu TG170 12 umaleko ENIG

I-PCB ye-High Layer (High Layer PCB) yi-PCB (iBhodi yeSekethe eShicileleyo, ibhodi yesekethe eprintiweyo) enemigangatho engaphezu kwe-8.Ngenxa yeenzuzo zayo zebhodi yesekethe enemigangatho emininzi, ukuxinana kwesekethe ephezulu kunokufezekiswa kwindawo encinci, eyenza uyilo oluntsonkothileyo lwesekethe, ngoko ilunge kakhulu kwisantya esiphezulu sokusetyenzwa komqondiso wedijithali, i-microwave radio frequency, imodem, isiphelo esiphezulu. umncedisi , ugcino lwedatha kunye neminye imihlaba.Iibhodi zeesekethe eziphakamileyo zivame ukwenziwa ngamabhodi aphezulu e-TG FR4 okanye ezinye izinto ze-substrate eziphezulu, ezinokugcina ukuzinza kwesiphaluka kwiqondo lokushisa eliphezulu, elinomswakama ophezulu, kunye ne-high-frequency environments.

Ngokumalunga namaxabiso e-TG ezixhobo zeFR4

I-FR-4 substrate yinkqubo ye-epoxy resin, ngoko ixesha elide, ixabiso le-Tg lilona phawu luqhelekileyo lusetyenziselwa ukuhlelwa kwe-FR-4 i-substrate grade, nayo enye yezona zibonakaliso zokusebenza ezibalulekileyo kwi-IPC-4101 inkcazo, i-Tg. Ixabiso lenkqubo yeresin, ibhekisa kwizinto ezisuka kwindawo eqinileyo okanye "yeglasi" ukuya kwindawo ekhubazeke ngokulula okanye ethambileyo yeqondo lotshintsho.Olu tshintsho lwe-thermodynamic luhlala lubuyiselwa umva nje ukuba i-resin ayiboli.Oku kuthetha ukuba xa into ifudumala ukusuka kwiqondo lokushisa ukuya kwiqondo lokushisa ngaphezu kwexabiso le-Tg, kwaye emva koko ipholile ngaphantsi kwexabiso le-Tg, inokubuyela kwimeko yangaphambili eqinile kunye neempawu ezifanayo.

Nangona kunjalo, xa izinto zifudunyezwa kwiqondo lobushushu elingaphezulu kakhulu kunexabiso layo le-Tg, utshintsho lwemo yesigaba esingenakuguqulwa lunokubangelwa.Umphumo wolu bushushu unento eninzi yokwenza kunye nohlobo lwezinto eziphathekayo, kunye nokuchithwa kwe-thermal ye-resin.Ngokuqhelekileyo, i-Tg ephezulu ye-substrate, iphezulu ukuthembeka kwezinto eziphathekayo.Ukuba i-lead-free welding process yamkelwa, ukushisa kwe-thermal decomposition (Td) ye-substrate kufuneka kuqwalaselwe.Ezinye izalathisi zokusebenza ezibalulekileyo ziquka i-thermal expansion coefficient (CTE), ukufunxwa kwamanzi, iipropathi zokuncamathela zezinto, kunye novavanyo lwexesha lokubeka ngokwesiqhelo olusetyenziswayo olufana novavanyo lwe-T260 kunye ne-T288.

Umahluko ocacileyo phakathi kwezinto ze-FR-4 lixabiso leTg.Ngokutsho kobushushu be-Tg, i-FR-4 PCB yahlulwe ngokubanzi kwi-Tg ephantsi, i-Tg ephakathi kunye neepleyiti ze-Tg eziphezulu.Kushishino, i-FR-4 ene-Tg ejikeleze i-135℃ idla ngokuhlelwa njenge-Tg PCB ephantsi;I-FR-4 malunga ne-150 ℃ yaguqulelwa kwi-Tg PCB ephakathi.I-FR-4 ene-Tg ejikeleze i-170 ℃ yahlelwa njenge-Tg ephezulu ye-PCB.Ukuba kukho amaxesha amaninzi okucinezela, okanye iileya ze-PCB (ngaphezu kwe-14 iileya), okanye ubushushu obuphezulu be-welding (≥230℃), okanye ubushushu obuphezulu bokusebenza (ngaphezu kwe-100℃), okanye uxinzelelo oluphezulu lwe-thermal (njenge-wave soldering), ephezulu Tg PCB kufuneka ikhethwe.