Iibhodi zesekethe ezininzi phakathi TG150 8 umaleko

Makhe sazise ulwazi oluthile lokutyeba kobhedu lwe-pcb.

Ifoyile yobhedu njengomzimba oqhubayo we-pcb, ukuncamathela ngokulula kumaleko wokugquma, ipateni yefom ye-corrosion yesekethe.Ubukhulu befoyile yobhedu buchazwa nge-oz(oz), 1oz=1.4mil, kunye nobukhulu obuphakathi befoyile yobhedu bubonakaliswa kubunzima beyunithi nganye. indawo ngokwefomula: 1oz=28.35g/ FT2(FT2 ziinyawo ezikwere, 1 unyawo lwesikwere =0.09290304㎡).
International pcb ifoyile yobhedu ngokuqhelekileyo kusetyenziswa ubukhulu: 17.5um, 35um, 50um, 70um.Ngokubanzi, abathengi abenzi iinkcazo ezikhethekileyo xa besenza i-pcb.Ubukhulu bobhedu lwamacala angatshatanga kunye namacala amabini ngokuqhelekileyo yi-35um, oko kukuthi, i-1 amp copper.Ngokuqinisekileyo, ezinye iibhodi ezicacileyo ngakumbi ziya kusebenzisa i-3OZ, i-4OZ, i-5OZ ... i-8OZ, njl., ngokweemfuno zemveliso ukukhetha ubukhulu obufanelekileyo bobhedu.

Ubukhulu bobhedu jikelele bebhodi yePCB enye namacala amabini bumalunga ne-35um, kwaye obunye ubunzima bobhedu yi-50um kunye ne-70um.Ubukhulu bobhedu obuphezulu bepleyiti ye-multilayer ngokuqhelekileyo yi-35um, kwaye ubukhulu bobhedu bangaphakathi yi-17.5um.Ukusetyenziswa kwebhodi yebhodi ye-Pcb ubukhulu bobhedu ikakhulu kuxhomekeke kusetyenziso lwe-PCB kunye nombane wophawu, ubungakanani bangoku, i-70% yebhodi yesekethe isebenzisa ubukhulu be-foil yobhedu 3535um.Ewe, okwangoku inkulu kakhulu ibhodi yesekethe, ubukhulu bobhedu buya kusetyenziswa 70um, 105um, 140um(zimbalwa kakhulu)
Ukusetyenziswa kwebhodi yePcb kwahlukile, ukusetyenziswa kobunzima bobhedu kwahlukile.Njengomthengi oqhelekileyo kunye neemveliso zonxibelelwano, sebenzisa i-0.5oz, 1oz, 2oz;Kuninzi lwangoku olukhulu, olunje ngeemveliso zombane ophezulu, ibhodi yobonelelo lwamandla kunye nezinye iimveliso, ngokuqhelekileyo zisebenzisa i-3oz okanye ngaphezulu kweemveliso zobhedu ezishinyeneyo.

Inkqubo yokulanyiswa kweebhodi zeesekethe ngokubanzi ngolu hlobo lulandelayo:

1. Ukulungiselela: Lungisa umatshini wokuthambisa kunye nezixhobo ezifunekayo (kubandakanywa iibhodi zeesekethe kunye neefolthi zethusi eziza kuhlanjululwa, iiplate ezicinezelayo, njl.).

2. Ukucoca unyango: Ukucoca kunye ne-deoxidize umphezulu webhodi yesiphaluka kunye ne-foil yobhedu ukuze ucinezele ukuqinisekisa ukusebenza kakuhle kwe-soldering kunye ne-bonding.

3. I-Lamination: Laminate ifoyile yobhedu kunye nebhodi yesekethe ngokweemfuno, ngokuqhelekileyo umaleko omnye webhodi yesiphaluka kunye nolunye uluhlu lwe-foil yobhedu lufakwe ngokuhlukileyo, kwaye ekugqibeleni ibhodi yesekethe ye-multi-layer ifunyenwe.

4. Ukubeka kunye nokucinezela: faka ibhodi yesekethe elaminated kumatshini ocinezelayo, kwaye ucinezele ibhodi yesekethe ye-multi-layer ngokubeka iplate yokucinezela.

5. Inkqubo yokucinezela: Ngaphantsi kwexesha elimiselweyo kunye noxinzelelo, ibhodi yesiphaluka kunye ne-foil yobhedu zixinzelelwe kunye ngomatshini wokucoca ukuze zihlanganiswe ngokuqinileyo.

6. Ukupholisa unyango: Beka ibhodi yesekethe ecinezelweyo kwiqonga lokupholisa unyango lokupholisa, ukwenzela ukuba ikwazi ukufikelela kwiqondo lokushisa elizinzileyo kunye noxinzelelo.

I-7.Inkqubo elandelayo: Yongeza i-preservatives ebusweni bebhodi yesekethe, yenza inkqubo elandelayo njengokugaya, ukufakwa kwepini, njl., Ukugqiba yonke inkqubo yokuvelisa ibhodi yesiphaluka.