Iibhodi zesekethe ezininzi phakathi TG150 8 umaleko

Makhe sazise ulwazi oluthile lokutyeba kobhedu lwe-pcb.

Ifoyile yobhedu njengomzimba oqhubayo we-pcb, ukuncamathela ngokulula kumaleko wokugquma, ipateni yefom ye-corrosion yesekethe.Ubukhulu befoyile yobhedu buchazwa nge-oz(oz), 1oz=1.4mil, kunye nobukhulu obuphakathi befoyile yobhedu bubonakaliswa kubunzima beyunithi nganye. indawo ngokwefomula: 1oz=28.35g/ FT2(FT2 ziinyawo ezikwere, 1 unyawo lwesikwere =0.09290304㎡).
International pcb ifoyile yobhedu ngokuqhelekileyo kusetyenziswa ubukhulu: 17.5um, 35um, 50um, 70um. Ngokubanzi, abathengi abenzi iinkcazo ezikhethekileyo xa besenza i-pcb. Ubukhulu bobhedu lwamacala angatshatanga kunye namacala amabini ngokuqhelekileyo yi-35um, oko kukuthi, i-1 amp copper. Ngokuqinisekileyo, ezinye iibhodi ezicacileyo ngakumbi ziya kusebenzisa i-3OZ, i-4OZ, i-5OZ ... i-8OZ, njl., ngokweemfuno zemveliso ukukhetha ubukhulu obufanelekileyo bobhedu.

Ubukhulu bobhedu jikelele bebhodi yePCB enye namacala amabini bumalunga ne-35um, kwaye obunye ubunzima bobhedu yi-50um kunye ne-70um. Ubukhulu bobhedu obuphezulu bepleyiti ye-multilayer ngokuqhelekileyo yi-35um, kwaye ubukhulu bobhedu bangaphakathi yi-17.5um. Ukusetyenziswa kwebhodi yebhodi ye-Pcb ubukhulu bobhedu ikakhulu kuxhomekeke kusetyenziso lwe-PCB kunye nombane wophawu, ubungakanani bangoku, i-70% yebhodi yesekethe isebenzisa ubukhulu be-foil yobhedu 3535um. Ewe, okwangoku inkulu kakhulu ibhodi yesekethe, ubukhulu bobhedu buya kusetyenziswa 70um, 105um, 140um(zimbalwa kakhulu)
Ukusetyenziswa kwebhodi yePcb kwahlukile, ukusetyenziswa kobunzima bobhedu kwahlukile. Njengomthengi oqhelekileyo kunye neemveliso zonxibelelwano, sebenzisa i-0.5oz, 1oz, 2oz; Kuninzi lwangoku olukhulu, olunje ngeemveliso zombane ophezulu, ibhodi yobonelelo lwamandla kunye nezinye iimveliso, ngokuqhelekileyo zisebenzisa i-3oz okanye ngaphezulu kweemveliso zobhedu ezishinyeneyo.

Inkqubo yokulanyiswa kweebhodi zeesekethe ngokubanzi ngolu hlobo lulandelayo:

1. Ukulungiselela: Lungisa umatshini wokuthambisa kunye nezinto ezifunekayo (kubandakanywa iibhodi zeesekethe kunye neefolthi zobhedu eziza kuhlanjululwa, iiplate ezicinezelayo, njl.).

2. Ukucoca unyango: Ukucoca kunye ne-deoxidize umphezulu webhodi yesiphaluka kunye ne-foil yobhedu ukuze ucinezele ukuqinisekisa ukusebenza kakuhle kwe-soldering kunye ne-bonding.

3. I-Lamination: Laminate ifoyile yobhedu kunye nebhodi yesekethe ngokweemfuno, ngokuqhelekileyo umaleko omnye webhodi yesiphaluka kunye nolunye uluhlu lwe-foil yobhedu lufakwe ngokuhlukileyo, kwaye ekugqibeleni ibhodi yesekethe ye-multi-layer ifunyenwe.

4. Ukubeka kunye nokucinezela: faka ibhodi yesekethe elaminated kumatshini ocinezelayo, kwaye ucinezele ibhodi yesekethe ye-multi-layer ngokubeka iplate yokucinezela.

5. Inkqubo yokucinezela: Ngaphantsi kwexesha elimiselweyo kunye noxinzelelo, ibhodi yesiphaluka kunye ne-foil yobhedu zixinzelelwe kunye ngomatshini wokucoca ukuze zihlanganiswe ngokuqinileyo.

6. Ukupholisa unyango: Beka ibhodi yesekethe ecinezelweyo kwiqonga lokupholisa unyango lokupholisa, ukwenzela ukuba ikwazi ukufikelela kwiqondo lokushisa elizinzileyo kunye noxinzelelo.

I-7.Inkqubo elandelayo: Yongeza izigcini kwindawo yebhodi yesekethe, yenza inkqubo elandelayo njengokugaya, ukufakwa kwepini, njl., Ukugqiba yonke inkqubo yokuvelisa ibhodi yesiphaluka.